Hydrogen Ion-Implantation in Smart- Cut SOI Fabrication Technique
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چکیده
منابع مشابه
Study on MEMS Fabrication Techniques and Applications
MEMS is the acronym for Micro Electro Mechanical Systems. Micromachining has potential applications for large area image sensors and displays, but conventional MEMS technology, based on crystalline silicon wafers cannot be used. Instead, large area devices use deposited films on glass substrates. This presents many challenges for MEMS, both as regards materials for micro-machined structures and...
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In this work, we have developed two different fabrication processes for relaxed Si1xGex-on-insulator (SGOI) substrates: (1) SGOI fabrication by etch-back approach, and (2) by “smart-cut” approach utilizing hydrogen implantation. Etch-back approach produces SGOI substrate with less defects in SiGe film, but the SiGe film uniformity is inferior. “Smart-cut” approach has better control on the SiGe...
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This paper presents a new, simple method of measuring the generation lifetime in SOI (silicon-on-insulator) MOSFETS. Lifetime is extracted from the transient characteristics of MOSFET subthreshold current. Using this technique, generation lifetime was mapped across ®nished SIMOX (separation by implantated oxygen) wafers, BESOI (bonded and etchedback SOI) wafers, and UNIBOND wafers. BESOI materi...
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Plasma immersion ion implantation (PIII) is an established technique in certain niche microelectronics applications such as the synthesis of silicon-oninsulator. In other applications such as shallow junction formation by plasma doping, trench doping, and fabrication of blue light emitting materials, PIII has unique advantages over conventional techniques and may be the technique of choice in t...
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Silicon-on-insulator ~SOI! has proven to be a viable alternative to traditional bulk silicon for fabrication of complementary metal–oxide–semiconductor devices. However, a number of unusual phenomena with regards to diffusion and segregation of dopants in SOI have yet to be explained. In the present study, SOITEC wafers were thinned to 700 and 1600 Å using oxidation and etching. Ion implantatio...
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